Multilayer Ferrite Chip Beads
Features : |
1. |
Tese small size chips generating high impedance
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2. |
Either flow or refow soldering methods can be use due to electroplating of the terminal electrodes
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3. |
High reliability due to an entirely monolitic structure
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4. |
Low DC resistance structure of electrode prevents wasteful electric power consumption
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Applications : To suppress EMI/RFI and to prevent self-oscillation in electronic products such as :
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1. |
Computers and peripheral equipment
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2. |
VCRS,Television,Pagers
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3. |
Cellular phones
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4. |
Digital communication equipment
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5. |
Various electronics equipments
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6. |
Circuit where a stable ground is unavailable
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