PERFORMANCE TEST
|
TEST METHOD
|
APPRAISE
|
Temperature Coefficient
|
MIL-STD-202F, Method 304 -55℃ to +125℃
|
±100ppm/℃
|
Thermal Shock
|
MIL-STD-202F, Method 107 5cycles,-55℃ to+125℃
|
±0.5%
|
Low Temperature Operation
|
MIL-R-55342D, Para.4.7.4 One hour at-55℃ followed by 45 minutes RCWV
|
±0.5% |
Short Time Overload
|
MIL-R-55342D, Para.4.7.5 2.5times RCWV for 5 seconds
|
±0.5% |
High Temperature Exposure
|
MIL-R-55342D, Para.4.7.6 125℃ for 100 hours
|
±0.5% |
Resistance to Soldering Heat
|
MIL-R-55342D, Para.4.7.7 Soldered to test board at 260℃ for 10 seconds
|
±0.5% |
Moisture Resistance
|
MIL-STD-202F, Method 106 10 cycles, Total 240 hour |
±0.5%
|
Life
|
MIL-STD-202F, Method 108A 1000 hours at 70℃ RCWV intermittent
|
±0.5% |
Solderability
|
MIL-STD-202F, Method 208 230℃ for 5 seconds
|
95%min.coverage |